Kumamoto University, Yamagata University, Fraunhofer IZM, and Fraunhofer EMFT Signed a Memorandum of Understanding
On September 15, 2026, Kumamoto University, Yamagata University, Fraunhofer IZM (Berlin), and Fraunhofer EMFT (Munich) signed a Memorandum of Understanding (MOU) to promote international collaboration in research, education, and human resource development.The MOU was concluded as part of ongoing efforts to promote Japan-Germany collaboration in the semiconductor field. With the support of the Japan External Trade Organization (JETRO), efforts have been made to strengthen collaboration among the four institutions.
The signing ceremony, held in Kumamoto City, was attended by Mr. Erik Jung of Fraunhofer IZM, Mr. Christof Landesberger of Fraunhofer EMFT, President Hisao Ogawa of Kumamoto University, and President Takeshi Deguchi of Yamagata University, who signed the MOU on behalf of their respective institutions. Representatives from JETRO and the Fraunhofer Representative Office Japan also attended the ceremony.
At the ceremony, the representatives expressed their expectations for further developing research collaboration in the semiconductor field, building on the strong partnerships and research networks that the institutions have established to date.
Under the MOU, the four institutions will strengthen their collaboration through exchanges of researchers, staff, and students, the promotion of joint projects, and the exchange of information related to research and education. In particular, the partnership is expected to create new opportunities by bringing together the respective strengths of the four institutions in areas such as semiconductor packaging, integration, and printed electronics.
Following the signing ceremony, a press conference was held, where representatives of the four institutions discussed their expectations for the MOU and future collaboration. They emphasized the importance of building on their respective strengths and creating a strong research cluster through closer collaboration. They also expressed their expectations that the partnership would lead to further research collaboration, cooperation with industry, and the practical application of research outcomes.
In connection with the Japan-Germany Joint Workshop, “Semiconductor Packaging: Toward Integration with Printed Electronics,” held at Kumamoto University on September 14, prior to the signing ceremony, the German representatives noted that they were particularly impressed by the strengths of Kumamoto-based companies, especially small and medium-sized enterprises, in semiconductor equipment and materials. They also expressed their expectations that the MOU would further expand collaboration not only with Kumamoto University in research, but also with local companies.
Drawing on his own background in medicine, President Ogawa also expressed his expectations for further collaboration between semiconductor technology and the medical field, including potential applications in areas such as catheters and electrocardiography.
Kumamoto University will use the signing of this MOU as an opportunity to further strengthen its partnerships with Yamagata University and the two Fraunhofer institutes and to promote international joint research and human resource exchange in the semiconductor field and beyond.
Representatives of the four institutions holding the signed MOU
Group photo of the participants at the signing ceremony
President Hisao Ogawa delivering remarks at the signing ceremony
Press conference held following the signing ceremony