Germany-Japan Joint Workshop Held at Kumamoto University Explores "Semiconductor Packaging" Toward Integration with Printed Electronics
On September 14, 2026, a joint workshop focusing on "Semiconductor Packaging" Toward Integration with Printed Electronics was held at Kumamoto University, attracting a large audience of researchers and industry professionals.This workshop was jointly organized by Kumamoto University, Yamagata University, JETRO Kumamoto, JETRO Yamagata, Fraunhofer IZM (Berlin), and Fraunhofer EMFT, both part of the Fraunhofer-Gesellschaft, one of Europe’s largest organizations for applied research. It was co-organized by the Kumamoto Semiconductor Green Innovation Council. Three German companies—Schmoll Maschinen, ORELtech, and Addsensor—also participated.
In the opening address, President Hisao Ogawa of Kumamoto University expressed his gratitude for the support from JETRO. He emphasized that deepening collaboration with the Fraunhofer-Gesellschaft, German enterprises, and Yamagata University presents an exceptional opportunity to drive technological advancement and innovation in Kumamoto. Furthermore, Yoshifumi Matsumura, Member of the House of Councillors, delivered a congratulatory address, expressing hopes that Kumamoto University will spearhead this collaboration to further boost the Kumamoto Science Park initiative.
The workshop featured in-depth presentations by representatives from Fraunhofer and the participating German companies, outlining cutting-edge technologies, ongoing research topics, and the broader landscape of the European semiconductor industry. Researchers from Tohoku University, Kumamoto University, and Yamagata University also introduced their respective semiconductor-related fields and talent development initiatives. Additionally, 21 Japanese semiconductor companies delivered short presentations on their business operations and technologies, followed by an interactive poster session and networking reception that fostered lively communication and mutual understanding.
Research Institutions Conclude Partnership Agreement
Building on the workshop's momentum, on September 15, Kumamoto University, Yamagata University, Fraunhofer IZM, and Fraunhofer EMFT concluded a cooperative agreement to strengthen collaboration among domestic and international research institutions in the semiconductor sector within Kumamoto Prefecture. Under this agreement, the institutions will advance joint research in "backend" semiconductor packaging technologies. The day also featured individual business-matching meetings with the Fraunhofer-Gesellschaft and German enterprises, providing an invaluable platform to explore new avenues for industrial and academic partnership.
Note: Fraunhofer-Gesellschaft is Europe's largest application-oriented research organization, operating 74 institutes and research units to drive industrial collaboration and technology commercialization. Fraunhofer IZM specializes in advanced electronic assembly and packaging, while Fraunhofer EMFT focuses on microelectronics, MEMS, and medical sensor technologies.
President Hisao Ogawa delivering the opening remarks
Director Hideya Miki giving a welcome address and
introducing the Fraunhofer Representative Office Japan
Yoshifumi Matsumura, Member of the House of Councillors, delivering a speech
Professor Tatsuhiro Takahashi, Special Advisor to the President of Yamagata University
and Secretary-General of the Japan-Germany Joint Workshop, emceeing the event
Mr. Christof Landesberger, Head of Flexible Systems at Fraunhofer EMFT
Mr. Julian Haberland of Fraunhofer IZM
Mr. Erik Jung of Fraunhofer IZM
Professor Takafumi Fukushima, Tohoku University
Specially Appointed Professor Shizuo Tokito, Yamagata University
Distinguished Professor Masahiro Aoyagi, Kumamoto University